Open Compute for hyper-scale efficiency, Facebook started Open Compute Project (OCP) in 2011 to share and foster innovation for the most energy efficient and economical data centers.
Today, many of world’s biggest cloud/Internet companies are participating: Microsoft, LinkedIn, Apple, Bank of America.
OCP has brought up blueprints for computing, storage, and networking that are derived directly from hyper-scale innovations.
Airframe OCP enhancements for telco:
EMI shielding Electric magnetic shielding is mandatory CE/FCC telco requirement.
Seismic tolerance. Open Rack v2 with single and dual rack seismic tolerance.
48VDC power. Enables telco’s to utilize existing -48VDC power feed.
OCP is designed to lower cost of infrastructure
Vanity free design without any unnecessary components;
Disaggregated rack level solution with common resources (e.g. power and storage);
Lower weight by removing unnecessary materials;
OCP is designed to lower cost of operations
Tool-less serviceability of hardware;
Maintenance operations from the front enable strict hot aisle containment;
Efficient cooling and higher operation temperature enabling low PUE (<1.1).
Nokia Airframe buidling blocks
42 OU / 21” rack (external width 600mm, similar to 19” rack)
Open Rack v2 specification
Two power zones with own power shelves
12,5 VDC busbar for power distribution
6PSU’s, 12,5 kW load capacity
Input dual 3P 208/230 VAC 50/60 Hz
Output 12,5 VDC busbar
2OU (96mm) shelf with three bays for compute
Open Rack V1 and V2 compatible
Dual-socket 2 OU and 1/3 shelf server node
Intel Xeon E5-2600 v4 Broadwell, up to 145W SKUs
16x DDR4 RDIMM modules
OCP mezzanine slot for dualport 1/10/25G NIC
2 PCIe, x8 and x16
1×3,5” or 6×2,5” storage
2 OU and full width unit
JBOD supporting up to 30 hot swappable 3,5” HDD drives
AirFrame maintenance switch (48+4 port 1RU management switch)